TSMC considers making AI memory chips at Nvidia’s request
Reported plans for vertically stacked DRAM could bring TSMC into competition with Samsung, SK Hynix and Micron.
TSMC has started drawing up plans to manufacture 3D DRAM following a request from Nvidia, its largest customer, according to reporting by The Information cited by Bloomberg and Reuters. The chipmaker is considering entering advanced memory production, rather than announcing a firm commitment.
Options include constructing factories or purchasing and converting an existing facility, Reuters reported, citing The Information. The proposed technology increases capacity by arranging memory cells vertically.
Hsu Kuo-chin, the TSMC vice president responsible for advanced packaging, is leading the work, according to the report. Neither company immediately provided a response to requests for comment.
The potential expansion comes amid memory shortages driven by demand from AI data centers. Micron expects supply constraints to continue into 2028. Manufacturing DRAM would make TSMC a competitor to Samsung, SK Hynix and Micron.
Nvidia reportedly approached those three memory suppliers in October about using TSMC’s 3nm process to manufacture the base layer for its custom HBM memory.
