Bosch to create semiconductor division with €5 billion sales target
The division will begin operating in January 2028 as Bosch seeks chip customers in robotics, factory automation, AI data centers and consumer devices.
Bosch said it will establish a division for its semiconductor operations in January 2028, aiming to generate around €5 billion in annual chip revenue by 2030 while broadening its customer base beyond automakers.
Called Semiconductors, the division will stay inside Bosch, not become an independent company. The chip operations are currently housed in Mobility Electronics, which will retain responsibility for making electronic control units used in vehicles.
Bosch plans to make its factories available to outside customers and grow its foundry operations, manufacturing chips for other companies. It is targeting robotics, factory automation, AI data centers, phones and wearables. The company said its components are already used to help control humanoid robots.
Its existing products include MEMS sensors, which measure motion and pressure in devices including smartphones and robots. Bosch also makes silicon carbide semiconductors and custom circuits used in power systems.
The company has around 40 chip sites globally. It has invested approximately €3 billion in wafer factories in Dresden and Reutlingen and is spending around US$2 billion to convert its Roseville, California, plant to produce silicon carbide chips.
Bosch also plans further expansion of its Penang, Malaysia, test center through the mid-2030s. It owns a 10% stake in ESMC, the semiconductor joint venture led by TSMC that is building a Dresden factory.
